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Process Development
From planning to production.

Laser Plastics Welding
Non-contact laser welding process.

Laser Cutting
Precise work with the UV laser.

Drilling Microvias
Manufacture of microvia holes with diameters of less than 200 microns.

Microprocessing Ceramics
Cutting, drilling, scribing and engraving of ceramics.
Solder-Resists and Foils
Laser machining of demanding solder mask in the HDI range <50 microns.

Repair & Rework
Solder resists and foils open and reduce scrap.

TCO / ITO Laser Processing
The finest insulation in the TCO layer invisible lasers.

Cutting Micro Parts
High-precision cutting parts with a thickness of up to 2 mm, cut from sheets.

More information
LPKF Laser & Electronics AG
 
Osteriede 7
D-30827 Garbsen
Germany
 
Tel.:
+49 (0)5131 7095-0
Fax:
+49 (0)5131 7095-29
E-Mail:
Contact form



Location Garbsen
LPKF Laser & Electronics AG
Osteriede 7
D-30827 Garbsen

Location Fürth
LPKF Laser & Electronics AG
Alfred-Nobel-Str. 55 - 57
D-90765 Fürth

Contact details
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