Specialist in Cutting and Structuring by Laser
Thorne Lietz moves from LPKF to LaserMicronics
He sees great market potential for laser cutting processes: 'Our UV laser cutting systems machine sensitive substrates without mechanical stress and with minimal thermal impact. Exciting applications are for example the reworking of PCBs, cutting and drilling of flexible substrates, metal layers on ceramics or the patterning of LTCC substrates.'
DownloadsPress release (pdf)
Picture material (jpg)
Image utilizationPhoto may be used for reports provided the source is mentioned. Resale to third parties is prohibited.
Tel.:+49 (0)5131 90811-0
Fax:+49 (0)5131 90811-29