LaserMicronics involved in MID application award
The application was created by the LPKF-LDS process (Laser Direct Structuring). The process integrates high resolution PCB layouts directly on to 3D Molded Interconnect Devices (MID). It is used especially for series production in telecommunication and automotive electronics.
About LaserMicronicsLaserMicronics GmbH specializes in micromachining and material processing with laser systems. Engineers and physicists work on the development of customer-specific solutions backed up by their wide-ranging pool of machines. The range of services includes feasibility studies, process optimization and the job-shop production of prototypes or series.
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