Laser Subtractive Structuring (LSS) Process

Producing injection-molded circuitry (3D) using subtractive technology

Any material on the market that can be metallised (e.g. PA6/6T, PBT, PET LCP, PC/ABS) can be employed. The copper-plated surface (e.g. 8 µm) is covered with an etch resist (e.g. Sn 2µm). A laser structures three-dimensional isolation tracks that are realised in the subsequent etching step. After removal of the remaining resist, the copper surfaces can be finished with nickel and gold.

This process is especially efficient for creating large-surface conductive paths on three-dimensional injection-molded components.