Metallization

The metallization part of the LPKF-LDS process begins with a cleaning step to remove laser debris. This is followed by additive build-up of the tracks with the help of current-free Cu baths.

An advantage of this procedure is that it dispenses with preliminary activation steps. Baths of this type typically deposit 3 – 5 µm/h. If a greater thickness of copper is required, this is achieved using standard electroforming Cu baths. Application-specific coatings such as Ni, Au, Sn, Sn/Pb, AG, AG/PD, etc., can also be created.


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