About MID

MID (Molded Interconnect Device) technology combines electrical and mechanical functions in a single component by installing conductive traces directly onto housings or other surfaces, bypassing the need for a printed circuit board at all. Space and weight savings are significant.

Typically, three-dimensional MID technology required 2-shot molding and hot embossing, but the initial cost is prohibitive for small production batches, prototyping and customized circuitry. Both methods require custom tooling and with increasing miniaturization of circuitry, modifying this tooling requires more time and money.

LPKF-LDS technology and LSS technology offers a flexible and economic alternative to these costly and time consuming choices.