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Microprocessing of Ceramics

Microprocessing of Ceramics

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Ceramic processing at LaserMicronics includes cutting, drilling and engraving of green ceramics as well as cutting, drilling, scribing, engraving and marking of sintered ceramics.
In this connection, laser processing facilitates production of complex geometries and guarantees a maximum of dimensional stability, edge quality and throughput.

The following ceramic materials can be processed:
  • Silicon nitride (Si3N4)
  • Aluminum oxide (Al2O3)
  • Aluminum nitride (AlN)
  • Zirconium oxide (ZrO2)
  • LTCC (low temperature co-fired ceramic)
  • Composite ceramic materials

Due to their outstanding electrical, mechanical and thermal characteristics, ceramics are increasingly used in the production of printed boards and electronic components.

Laser cutting and drilling

In laser cutting, a continuous kerf is created, e.g., as an opening, contour cut or hole.

Laser drilling allows production of the smallest hole diameters (for example, <75 μm in LTCC with high aspect ratios). Essential features of the processing are ultra-fine structures with high-quality edge structures.

Laser scribing

In laser scribing, a kerf that is 20 μm to 50 μm deep is initially cut in the ceramic material. The depth of the scribing can be controlled by precisely adjusting the laser focus. Then the material is broken along this kerf. Laser scribing allows clean cutting of segments with high quality and accuracy.

In contrast to mechanical processing, no micro-cracks are caused in the material. Since only a little material is vaporized, the laser works with very high scribing speeds of up to 100 mm/sec without damaging the material.

Fuel cell technology

Processing of a membrane electrode assembly (MEA) with graphite ablation on both sides in only one work step.

With the process developed by LaserMicronics, the graphite is reliably ablated on both sides without damaging the MEA Nafion core membrane. In addition, the entire MEA can be cleanly cut to the desired shape and size.

Advantages of laser Microprocessing

  • High degree of edge steepness
  • Low degree of edge roughness
  • No formation of micro-cracks
  • Holes <75 μm in high aspect ratios possible
  • Low thermal influence due to optimized UV processing
  • Contactless material processing, thus no material deformation
  • High level of precision and positional accuracy of the cut edges due to automatic recording

Your contact
Thorne Lietz
Thorne Lietz
Laser Cutting and Structuring Technology
 
Tel.:
+49 (0)5131 90811-2522
E-Mail:
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Garbsen, Germany
LaserMicronics GmbH
Osteriede 9a
D-30827 Garbsen

Fürth, Germany
LaserMicronics GmbH
Alfred-Nobel-Str. 55 - 57
D-90765 Fürth

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