Micromachining of ceramic

Micromachining of ceramic materials: Cutting, drilling, scribing, engraving and marking of green and sintered ceramics

Micro-processing of ceramics using lasers is becoming increasingly important. Because of their superb electrical, mechanical and thermal properties, ceramics are being increasingly used in the manufacture of circuit boards and electronic components.

The laser processing carried out with LPKF equipment involves the cutting, drilling and engraving of green ceramics, as well as cutting, drilling, scribing, engraving and marking of sintered ceramics.

The following ceramic materials can be processed:

• Silicon nitride (Si₃N₄)
• Aluminium oxide (Al₂O₃)
• Aluminium nitride (AlN)
• Zirconium oxide ZrO₂
• LTCC (low temperature cofired ceramic)
• Ceramic composites

Laser processing makes it possible to create complex geometries, and guarantees maximum dimension integrity, edge quality and throughput.


Read further under Marking and Engraving