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Laser cutting and drilling

Opening in a 630 μm thick sintered ceramic substrate
In laser cutting, a top to bottom cut is created, e.g. as an opening, a contour cut or a hole.








Guide hole for probe card, Ø 80 μm, roundness 2 μm
Laser drilling is used to create ultra-fine holes, e.g. <75 μm in LTCC with a high aspect ratio. The special benefits of this type of processing are ultra-fine structures with very high quality edges.







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LaserMicronics GmbH
Osteriede 9a             
D-30827 Garbsen

Tel.: +49 5131 90 811-0
Fax: +49 5131 90 811-29

Email: info@lasermicronics.de

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LaserMicronics GmbH      Osteriede 9a      D-30827 Garbsen      Tel: +49-(0)5131-90811-0      Fax: +49-(0)5131-90811-29