Trough glass vias (TGV) and precision cutting in thin glass using the Laser Induced Deep Etching (LIDE) process
LaserMicronics uses Laser Induced Deep Etching (LIDE) technology, which has been specially developed for processing the thinnest glass substrates. Glass up to a thickness of 500 µm can be easily, quickly and precisely drilled and cut in a two-stage process consisting of laser modification and chemical processing. The LPKF Vitrion 5000 system is used for the laser processing.
As a partner for industry and research, LaserMicronics´ specialists modify thin glass for various applications and in different quantities. The package of LIDE process technology and high-end laser system LPKF Vitrion opens up new possibilities for glass as a material for numerous applications, e. g. in microfluidics, display manufacturing, MEMS technology or chip production.
Advantages of LIDE compared to conventional thin glass processing methods:
- the precisely machined thin glass up to a thickness of 500 µm remains free of microcracks and stresses
- the glass remains stable and can therefore also be used in industrial areas where it was previously considered too fragile
- extraordinary speed: more than 5000 prepared holes per second or cutting speeds up to 100 mm/sec.
- Smallest structure sizes > 10 µm are possible
- high aspect ratios in the range > 1:10.
Why glass?The advantages of glass over other substrates are obvious and can be fully exploited using the LIDE process:
- Chemical inertness
- High surface quality
- Ability to withstand high temperatures
- No moisture absorption and therefore no expansion
- Adjustable thermal expansion coefficient
- Dimensional stability
- Very good dielectric properties
- Low procurement costs in comparison with other substrates even in very thin forms
- Transparency and attractive haptics
Dipl.-Ing. Thomas Nether
Tel.:+49 (0)5131 90811-0