LDP Process

Thin Layer Structuring

Thin metallic (Cu, Au, Al, Pd, Pt, ...) or organic layers (conductive polymers, organic dielectrics, ...) with thicknesses up to approx. 200 nm on flexible or rigid substrates are ablated and thus structured by using the mask projection technique. The UV-laser beam is expanded to an area through special optics. The layout to be structured is on a quartz mask. It is scaled down onto the substrate by means of special projection lenses. The laser ablation guarantees highest throughput.


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