Laser Cutting

High-precision laser cutting of flexible, flex-rigid and thin multilayers

UV-laser processing enables cutting clean contours in all circuit board types and materials conventionally used for circuit board production.

This includes:

• FR4 multilayer
• Flexible circuit boards
• Flex-rigid circuit boards
• Ceramics
• LTCC (low temperature cofired ceramics)
• RF materials (Rogers®, Teflon®)
• Combinations thereof

The focussed laser beam reliably cuts through all layers in one or a few steps.

Because of the contact-free material processing, there is no distortion even when thin materials are used, as it might be the case when milling or punching out. In combination with the fiducial registration and online scaling, already existing distortions can be compensated and the cut contours positioned precisely within the layout.

Due to the direct material vaporisation, the UV-laser minimises the formation of molten material to prevent burring and delamination of compound materials.

As a result, laser cutting creates precise, almost radius-free cut contours. The cut edges are smooth and vertical. This guarantees a maximum of dimension integrity, edge quality and throughput.


Read further under Advantages Laser Cutting