MIDStructuring of three dimensional circuit carriers (Molded Interconnect Devices).
Laser WeldingLaser welding of plastics offers many technical and economic advantages in relation to conventional welding methods.
Laser CuttingCutting flexible, flex-rigid and thin multilayer circuit boards.
Laser Direct PatterningTechnology for the production of thin ultra-fine conductor lines <15 μm.
Laser structuring of tin-resistLaser direct structuring of etching or plating resist.
Drilling MicroviasDrilling microvias in HDI circuit boards.
Micromachining CeramicMicromachining of ceramic materials: Cutting, drilling, scribing, engraving and marking.
Solder-Resists and FoilsUltra-fine structuring of solder-resists and cover foils.
Repair and ReworkLaser rework and repair of printed circuit boards.
Fuel Cell TechnologyLaser cutting and structuring of MEA.
TCO / ITO Laser ProcessingInvisible laser structuring.
Cutting Micro PartsCutting of stainless steel, nickel, molybdenum and titanium with high precision.
Laser SystemsThe spectrum of systems of LaserMicronics covers high end products with laser sources for most different applications.