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Process Development
3D MID/ LDS
Laser Welding
Laser Cutting
Laser Direct Patterning
Laser structuring of tin-resist
Drilling Microvias
Microprocessing Ceramic
Solder-Resists and Foils
Repair & Rework
TCO / ITO Laser Processing
Cutting Micro Parts
Process Development
From planning to production.
3D MID/ LDS
Plastic components with mechanical and electrical functions provided.
Laser Welding
Non-contact laser welding process.
Laser Cutting
Precise work with the UV laser.
Laser Direct Patterning
Ultra-fine laser ablation with excimer lasers to create.
Drilling Microvias
Laser processing of tin-resist by HDI both 50 microns.
Drilling Microvias
Manufacture of microvia holes with diameters of less than 200 microns.
Microprocessing Ceramic
Cutting, drilling, scribing and engraving of ceramics.
Solder-Resists and Foils
Laser machining of demanding solder mask in the HDI range <50 microns.
Repair & Rework
Solder resists and foils open and reduce scrap.
TCO / ITO Laser Processing
The finest insulation in the TCO layer invisible lasers.
Cutting Micro Parts
High-precision cutting parts with a thickness of up to 2 mm, cut from sheets.
More information
LaserMicronics GmbH
Osteriede 9a
D-30827 Garbsen
Tel.:
+49 (0)5131 90811-0
Fax:
+49 (0)5131 90811-29
E-Mail:
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LaserMicronics GmbH • Osteriede 9a • D-30827 Garbsen • Germany • Tel: +49 (0) 5131 90811-0 • Fax: +49 (0) 5131 90811-29
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Garbsen, Germany
Osteriede 9a
30827 Garbsen
Erlangen, Germany
Gundstraße 15
91056 Erlangen
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