Services

Process Development
From planning to production.

3D MID/ LDS
Plastic components with mechanical and electrical functions provided.

Laser Welding
Non-contact laser welding process.

Laser Cutting
Precise work with the UV laser.

Laser Direct Patterning
Ultra-fine laser ablation with excimer lasers to create.

Drilling Microvias
Laser processing of tin-resist by HDI both 50 microns.

Drilling Microvias
Manufacture of microvia holes with diameters of less than 200 microns.

Microprocessing Ceramic
Cutting, drilling, scribing and engraving of ceramics.

Solder-Resists and Foils
Laser machining of demanding solder mask in the HDI range <50 microns.

Repair & Rework
Solder resists and foils open and reduce scrap.

TCO / ITO Laser Processing
The finest insulation in the TCO layer invisible lasers.

Cutting Micro Parts
High-precision cutting parts with a thickness of up to 2 mm, cut from sheets.