Under production conditions, laser processing is an efficient technology for producing microvia holes with diameters less than 200 μm. However, high density interconnect (HDI) technology in particular requires connecting bores with diameters of at least 50 μm. Microvias can be drilled in the materials RCC, FR4, FR5, TeflonTM
When drilling with the UV laser, both the copper top layer as well as the substrates made of epoxy resin and glass fibers are pierced in one operation. The laser energy is controlled so precisely here that the lower strip conductor layer is only lightly roughened and at the same time cleaned. In contrast to CO2 and hybrid laser systems, LaserMicronics requires neither an upstream etching process nor a second laser.
UV laser processing offers short pulse lengths in the nanosecond range, which leads to high pulse peak outputs. The laser process thus guarantees very good hole quality and at the same time high throughput.
Advantages of UV laser drilling
- Holes in various materials, e.g., RCC, FR4, FR5, Teflon® and Thermount®
- No delamination and reduced “red ring effect”
- Automatic correction of position and deformations by recording the corner marks and online scaling
- High level of precision and positional accuracy of the holes
- Ideal hole geometry