Laser structuring of tin-resist

Production of ultra-fine lines (50 μm lines/spaces) by laser-structuring of chemical tin (tin-resist technology)

Photo-lithographic exposure hits physical and economic boundaries when faced with the required enhancement in resolution of the circuit layout for high density interconnects (HDI) in particular.

In conventional film exposure, material distortion in the inner and/or outer layers and in the films themselves can cause registration and positioning problems and thus considerably reduce the yield. In many cases, high densities are only specified in specific areas within one layer of an HDI circuit board.

Whereas most of the area can be produced using conventional photo-lithographic techniques, an efficient alternative for high density areas is tin-resist technology. This enables the economic production of parts of the circuit board with 50 μm lines and spaces, at the same time guaranteeing high yields.


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