Business Activities

MID
Structuring of three dimensional circuit carriers (Molded Interconnect Devices).

Laser Plastics Welding
Laser welding of plastics offers many technical and economic advantages in relation to conventional welding methods.

Laser Cutting
Cutting flexible, flex-rigid and thin multilayer circuit boards.

Laser Direct Patterning
Technology for the production of thin ultra-fine conductor lines <15 μm.

Laser structuring of tin-resist
Laser direct structuring of etching or plating resist.

Drilling Microvias
Drilling microvias in HDI circuit boards.
 

Micromachining Ceramic
Micromachining of ceramic materials: Cutting, drilling, scribing, engraving and marking.

Solder-Resists and Foils
Ultra-fine structuring of solder-resists and cover foils.

Repair and Rework
Laser rework and repair of printed circuit boards.

Fuel Cell Technology
Laser cutting and structuring of MEA.

TCO / ITO Laser Processing
Invisible laser structuring.

Cutting Micro Parts
Cutting of stainless steel, nickel, molybdenum and titanium with high precision.