Germany, Nuremberg / NürnbergMesse, Halle 5, Stand 434 (LPKF Laser & Electronics AG / LaserMicronics GmbH)
SMT Hybrid Packaging is Europe´s leading event on System Integration in Micro Electronics.
Part of it is the Future Packaging Joint Booth organized by Fraunhofer IZM. Its live production line provides a unique glimpse of the manufacturing process and the technologies that make it possible. Visitors get to judge the performance of the machines for themselves by seeing them in operation in an environment that mimics actual manufacturing conditions.
LPKF and LaserMicronics participate in the production line and present the laser-depaneling system LPKF MicroLine 2000 Ci.