Laser scribing

Laser scribing initially involves introducing a 20 to 50 μm thick groove in the ceramic material. The material along this groove is then broken. Laser scribing makes it possible to cleanly separate segments with a high level of quality and accuracy.

Unlike mechanical processing, this method leaves no micro-fractures in the material. And because only a minor amount of material is ablated, very high scribing speeds of up to 100 mm/s are possible (depending on the material) without generating the micro-fractures typical of mechanical processing.


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