Services > Business Activities > Micromachining Ceramic > Cutting and Drilling
l Search l Legal Notices
Home
Job Shop Service of Laser Micromachining
Services Company Support Contact
Services Overview Business Activities MID Laser Plastics Welding Laser Cutting Laser Direct Patterning Laser structuring of tin-resist Drilling Microvias Micromachining Ceramic Marking and Engraving Cutting and Drilling Scribing Advantages laser micro-machining Solder-Resists and Foils Repair and Rework Fuel Cell Technology TCO / ITO Laser Machining Laser Systems

Laser cutting and drilling

Opening in a 630 μm thick sintered ceramic substrate
In laser cutting, a top to bottom cut is created, e.g. as an opening, a contour cut or a hole.








Guide hole for probe card, Ø 80 μm, roundness 2 μm
Laser drilling is used to create ultra-fine holes, e.g. <75 μm in LTCC with a high aspect ratio. The special benefits of this type of processing are ultra-fine structures with very high quality edges.







Read further under Scribing
Product information
Download (1555 KB)

LaserMicronics GmbH
Osteriede 7             
D-30827 Garbsen

Tel.: +49-(0)5131-90811-0
Fax: +49-(0)5131-90811-29

Email: info@lasermicronics.de

© by lasermicronics
LaserMicronics GmbH      Osteriede 7      D-30827 Garbsen      Tel: +49-(0)5131-90811-0      Fax: +49-(0)5131-90811-29