Advantages of laser cutting

• Clean cutting edges, no burring
• Cutting of extremely fine contours and virtually radius-free internal edges
• Minimal thermal stress, i.e. no delamination
• Cutting of various material thicknesses and combinations in one job
• Separation of assembled circuit boards
• Contact-free material processing to prevent material distortion
• No fixing device or protective cover necessary
• High precision and position accuracy of cutting egdes through automatic fiducial registration