Laser Direct Structuring (LDS) Process

Advantages of the LPKF-LDS process

More flexibility – The laser transfers the artwork directly from the computer to the injection molded component. Structure new circuit designs directly on a plastic component.

Reduced tooling cost – LDS does not require custom designed tooling for the interconnect structure. The only tooling required is the injection mold for the plastic component itself.

Higher circuit density – The small focus of the laser and the direct application of the artwork from the data allows much higher circuit density and finer structures.

Higher cost efficiency – LDS technology provides higher yield in components with fine interconnect structures and is more cost-effective for small to medium production runs.

Environmentally friendly − no caustic or etching chemicals used.


Read further under Material Selection